RAK3172 Description

The RAKwireless RAK3272S Breakout Board is designed to facilitate easy access to the board's pins, streamlining development and testing processes. Its footprint follows the XBee form factor, enabling the RAK3172 stamp module pins to be transferred to 2.54 mm headers. The board operates on firmware based on RAKwireless Unified Interface V3 (RUI3), which allows the creation of various functionalities through RUI APIs.

• Based on RAK3172
• I/O ports: UART/I2C/GPIO/SPI
• Serial Wire Debug (SWD) interface
• 64 KB RAM
• RUI3 API Compatible
• AT Commands Support
• Supported bands: (EU433, CN470, RU864, IN865, EU868, AU915, US915, KR920, and AS923)
• Alpha Micro technical support available for maximum benefit for your application

• Based on RAK3172
• I/O ports: UART/I2C/GPIO/SPI
• Serial Wire Debug (SWD) interface
• Module size: 25.4 x 32.3 mm
• Supply Voltage: 2.0 V ~ 3.6 V
• Temperature Range: -40° C ~ 85° C

What is included?

• 1pc RAK3272S the RAK3172 Breakout Board
• 1pc LoRa® antenna with RP-SMA female connector
• 18pcs Dupont lines

Design Support

• Circuit Schematics
• RAK3172 example C Code
• IoT Expertise and advice from our experience with the RAK3172